NFC FPC label te hi i hre tawh em ?

NFC FPC label hi FPC board a siam a ni a, a siam dan pawh a inang lo hle. Flexible printed circuit board (FPC board) hi rintlak leh flexible tak, polyimide emaw polyester film emaw a base material atana siam a ni. Wiring density sang, rit lo, thickness thin leh bendability tha tak tak te characteristic a nei bawk.
FPCB board hmanga NFC tag chu base material atan awlsam takin smart wearable device hrang hrang Bluetooth speaker, NFC ring, leh NFC wristband-ah te dah theih a ni. NFC Mobile Phone hi device power on theihna tur leh pairing process zawh theihna tur trigger turin biak theih a ni.
A thil neihte a tihkhawtlai avangin, traditional etched aluminum antennas chuan antennas te zawk a siam thei lo. Copper material property nena khaikhin chuan copper hi a stable zawk a, etching pawh a do thei a, antennas frequency stable zawk leh size tlem zawk a siam thei bawk. Small precision antennas siamchhuah hi electronic label industry-ah chuan harsatna lian tak a ni fo a, copper antennas hman hian he harsatna hi hlawhtling takin a chinfel sak a ni.

Tunlai chip packaging process eng emaw zat hman a thatna leh that lohna kan teh hnuah, stability testing history rei tak leh industry pawm zau tak a neih tawh avangin COB process chu kan rel ta a ni. He packaging procedure hi thil harsa tak takah hman theih a ni a, a hnu lamah chuan package chi hrang hrang a awm thei bawk.
NFC technology lar leh hman a nih avangin electronic tag package size a tlem a, environment mamawh a khauh zawk a, structure mamawh pawh a hniam zawk bawk.

He industry-in electronic label packaging atana a bottleneck chu he product solution siamna atana lungphum atan a hmang a ni. PI base material kan hmang a, copper etching technology hmanga siam a ni a, industry micro-bonding process kan hmang a, post{2}}processing nen kan inzawm a, he product siam chhuah hi kan zo ta a ni. Proposal atanga realization thlengin, material hman dan leh industry process characteristic requirements te nen a inzawm a ni. Consumer-te satisfaction a dawng a, a chhan chu a hlat zawng a sang a, a performance a inmil a, compact size leh structure a nei a, temperature resistance a sang hle a, etc.

FPC Label Features:
1. Temperature sang tak a awm theih loh;
2. Bending laka inven theih;
3. Chemical hmanga do theihna;
4. Pressure resistance nei .
5. A lian lo, hman awlsam .
High-temperature condition-ah chuan inventory management atan te, assembly line production data control nan te, incoming leh exiting goods inventory emaw, injection molding injection molded parts nena inzawm emaw atan an hmang fo thin. FPC a siam RFID electronic tag chu injection molded part nen a inzawm a, hei hian RFID electronic tag chu a chhe thei lo emaw, a fak emaw thei lo thei a, a temperature a sang lutuk avangin injection molding process chhungin RFID chip a tichhia lo ang. Anti-counterfeiting effect hi a tha zawk a, thil lem (cornerfeited items) traceability-ah pawh a hman theih nasa hle.